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Tuesday, October 16 • 1:00pm - 1:50pm
IIoT3: IoT Enabling Flexible Circuits with Integrated Sensors, Secure Wireless Communication/Power, Advanced Chip Packaging, and Shape Memory Actuation

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Enabling IoT development by utilizing roll to roll semi-additive process technology for cost effective solutions. IoT requires sensors, actuators, wireless communication and power in a small, customized form factor. Roll to roll semi-additive manufacturing can provide some of the best processes of both PCB/flex and silicon fabrication. Roll to roll semi-additive technology enables one process technology to make the functional component integrated into the package. Such as strain gauges, RTDs and shape memory actuators.
Speakers
avatar for Peter Ladwig

Peter Ladwig

Senior Director, Technology Development, TDK - Hutchinson Technology
Peter Ladwig currently serves as Senior Director of Technology Development for TDK-Hutchinson Technology, where he directs a team of over 50 scientists, engineers and technicians in the development of new products and manufacturing processes. He holds a BS degree in Mechanical Engineering... Read More →

Tuesday October 16, 2018 1:00pm - 1:50pm CDT
Theater 2
  Conference Session